フェノール成形材料

Phenolic Moulding Compound With Dielectric Strength 20-30 KV/Mm Thermal Expansion 2.5-4.5 X 10-5/K Product Description: Phenolic moulding compound is a widely used moulding material composed of phenol resin and various additives. With low cost and excellent comprehensive performance, it is widely used in electrical and electronics industries. Phenolic moulding compound has excellent thermal conductivity, flammability, thermal expansion, melting point and compressive strength.

High Thermal Expansion Phenolic Molding Compound With Dielectric Strength 20-30 KV/Mm 2.5-4.5 X 10-5/K Product Description: Phenolic Moulding Compound is a type of phenolic moulding material compound that features excellent performance and properties. It has a water absorption rate of less than 1.5%, a compressive strength of 50-70 MPa, and a melting point of 140-160℃. In addition, this phenolic moulding compound also has a thermal conductivity of 0.2-0.3 W/mK, making it a

Product Description: Phenolic moulding compound is a type of phenolic moulding material with a melting point ranging from 140 to 160℃. It is a brown powder which has a low water absorption rate of less than 1.5%, and a high dielectric strength of between 20 and 30 KV/mm. The material has an uniform appearance and is widely used in the production of electrical and electronic components. Phenolic moulding compound is lightweight, strong, and heat-resistant, making it an ideal

Product Description: Phenolic Molding Compound is a kind of phenolic moulding material that is widely used in a variety of applications. It is distinguished by its outstanding properties, such as water absorption of less than 1.5%, compressive strength of 50-70 MPa, thermal expansion of 2.5-4.5 x 10-5/K, and flexural strength of 50-70 MPa. Phenolic Molding Compound also provides excellent performance for good electrical insulation and resistance to chemicals. It is an ideal

High Melting Point Phenolic Moulding Material With Thermal Expansion 2.5-4.5 X 10-5/K Product Description: Phenolic moulding compound is a phenolic moulding material used in industries like electrical, automotive, and machine tools. It is a powder form material that has a density of 1.2-1.6 G/cm3, flexural strength of 50-70 MPa, and impact strength of 7-10 KJ/m2. It has low water absorption rate of ≤1.5 %, and is used for the production of high-quality, durable components.

Bakelite Powder Phenolic Moulding Compound 1. Product Description 2. Selection of Modeling and Manufacturing Conditions To accommodate different requirements of the modeling industry, we have successfully developed compression modeled and plastic injection modeled top-grade compound UFC grain materials according to requirements of different customers. The formation and manufacturing process must be carried out with suitable control parameters according to the shape, size,

Electrical grade moulding phenolic molding compound bakelite powder 1.the picture of phenolic molding compound powder 2.Electrical grade moulding phenolic molding compound bakelite powder The bakelite phenolic molding compound used for manufacturing electronic and electrical appliances and daily industrial products, as well as automobile parts. It is mainly phenolic plastic with wood powder as filler, and is formed by molding (injection molding, die casting, transfer molding)

Electrical Appliance Bakelite Powder And Kitchenware Handle Phenolic Moulding Compound 1.Product Description 2.Specification item value CAS No. None Other Names Phenolic Moulding Powder Place of Origin China Grade Standard Other Plastic Raw Materials Purity 100% Appearance Standard grade, flame retardant grade Application Plastic Products/Making Tool Handles, Electrical and appliance applic Brand Name Dongxin Or Customized Model Number KE3388C6 Color Black Or Customized