phenolic moulding compound 20kv mm

Phenolic Moulding Compound With Dielectric Strength 20-30 KV/Mm Thermal Expansion 2.5-4.5 X 10-5/K Product Description: Phenolic moulding compound is a widely used moulding material composed of phenol resin and various additives. With low cost and excellent comprehensive performance, it is widely used in electrical and electronics industries. Phenolic moulding compound has excellent thermal conductivity, flammability, thermal expansion, melting point and compressive strength.