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phenolic moulding compound 20kv mm

2.5-4.5 X 10-5/K Związek do formowania fenolu o wytrzymałości dielektrycznej 20-30 KV/mm

Phenolic Moulding Compound With Dielectric Strength 20-30 KV/Mm Thermal Expansion 2.5-4.5 X 10-5/K Product Description: Phenolic moulding compound is a widely used moulding material composed of phenol resin and various additives. With low cost and excellent comprehensive performance, it is widely ...